Surface Mount Technology Capability
- BGA, PoP, SCM packages
- uBGA (<.3mm pitch)
- Leadless devices (QFN ,DFN)
- Miniature Chip – 01005, 0201
- Custom retained thermal profiles
- Laser cut and step custom designed solder stencils
- BGA reball and repair
Kodiak Assembly Solutions’ state-of-the-art, Fuji Surface Mount line configurations offer flexibility for any mix of customer requirements in surface mount technology (SMT). Kodiak Assembly Solutions has created an effective solution for all levels of production, from prototyping to ramping for high volume production in SMT.
Engineering Support DFM/DFT
- Manufacturing Engineering Design for manufacturability and test (DFM / DFT)
- Process Engineering reviews
- Custom thermal profile generation for every assembly.
- Custom designed laser cut solder stencils
- Test engineering development and support.
Printed Circuit Board Design (PCB Design)
Kodiak Assembly Solutions offers a one PO PCB design solution for all ranges of complexity.
Kodiak Assembly Solutions’ design and layout partners support Allegro, OrCAD, Altium and Mentor PADS. Kodiak Assembly Solutions manages the process from design to manufacturing and guarantees the same high-quality results.